Fiber array to chip attach using laser fusion splicing for low loss

Multiple fiber-to-chip fusion splicing has the potential to enable high throughput optical packaging with a robust, high efficiency, and low-cost solution. Packaging of multiple fibers in a single shot significantly increases the throughput of photonic packaging. The laser fusion splicing method enables optical packaging of photonic devices without the use of adhesives making them robust and tolerant to environmental fluctuations. The method is compatible with multiple photonic platforms, such as silicon, silicon nitride, aluminum nitride, and lithium niobate, which use silicon dioxide as cladding. We envision that this method can be fully automated to enable highly efficient fiber-to-chip coupling in high-volume applications and can be extended to passive alignment techniques.